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Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages.

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Bibliographic Details
Title:	Impact of Thermally Conductive Adhesive Film on the Thermal Reliability of Multi-Chip COB LED Packages.
Authors:	Wu, Tianqi¹, Shen, Jichen^1,2, Zou, Jun^1,3, zoujun@sit.edu.cn, Liao, Yitao^1,2, Wu, Peng^2,3
Source:	Applied Sciences (2076-3417); May2026, Vol. 16 Issue 10, p4597, 20p
Database:	Applied Science & Technology Source
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Description
ISSN:	20763417
DOI:	10.3390/app16104597