Prediction of clamping pressure in a Johnsen-Rahbek-type electrostatic chuck based on circuit simulation.

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Bibliographic Details
Title: Prediction of clamping pressure in a Johnsen-Rahbek-type electrostatic chuck based on circuit simulation.
Authors: Kanno, S.1, kanno-s@crl.hitachi.co.jp, Kato, K.2, Yoshioka, K.3, Nishio, R.3, Tsubone, T.3
Source: Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; Jan/Feb2006, Vol. 24 Issue 1, p216-223, 8p, 4 Diagrams, 2 Charts, 10 Graphs
Database: Applied Science & Technology Source
Description
ISSN:10711023
DOI:10.1116/1.2151219