Modeling and characterization of molding compound properties during cure
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| Title: | Modeling and characterization of molding compound properties during cure |
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| Authors: | Jansen, K.M.B.1, k.m.b.jansen@tudelft.nl, Qian, C.1, Ernst, L.J.1, Bohm, C.2, Kessler, A.2, Preu, H.2, Stecher, M.2 |
| Source: | Microelectronics Reliability; Aug2009, Vol. 49 Issue 8, p872-876, 5p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
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| DOI: | 10.1016/j.microrel.2009.03.007 |
