Interfacial oxide growth and filling-up behaviour of the micro-gap in silicon fusion bonding processes.
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| Title: | Interfacial oxide growth and filling-up behaviour of the micro-gap in silicon fusion bonding processes. |
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| Authors: | Ju, B. K., Oh, M. H., Tchah, K. H. |
| Source: | Journal of Materials Science; March 1 1993, Vol. 28, p1168-1174, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00222461 |
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| DOI: | 10.1007/BF01191948 |
