Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate.

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Bibliographic Details
Title:	Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate.
Authors:	Yoon, J.-W., Lee, C.-B., Jung, S.-B.
Source:	Materials Science & Technology; August 2003, Vol. 19 Issue 8, p1101-1106, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	02670836
DOI:	10.1179/026708303225003063