APA (7th ed.) Citation

Yoon, J., Lee, C., & Jung, S. (2003). Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate. Materials Science & Technology, 19(8), 1101. https://doi.org/10.1179/026708303225003063

Chicago Style (17th ed.) Citation

Yoon, J.-W, C.-B Lee, and S.-B Jung. "Activation Energies of Intermetallic Compound Growth at Interface Between Sn-5Bi-3.5Ag Solder and Cu Substrate." Materials Science & Technology 19, no. 8 (2003): 1101. https://doi.org/10.1179/026708303225003063.

MLA (9th ed.) Citation

Yoon, J.-W, et al. "Activation Energies of Intermetallic Compound Growth at Interface Between Sn-5Bi-3.5Ag Solder and Cu Substrate." Materials Science & Technology, vol. 19, no. 8, 2003, p. 1101, https://doi.org/10.1179/026708303225003063.