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Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate.

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Title: Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate.
Authors: Yoon, J.-W., Lee, C.-B., Jung, S.-B.
Source: Materials Science & Technology; August 2003, Vol. 19 Issue 8, p1101-1106, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500874030
AccessLevel: 2
PubType: Academic Journal
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  Data: Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate.
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  Data: <searchLink fieldCode="AU" term="%22Yoon%2C+J%2E-W%2E%22">Yoon, J.-W.</searchLink><br /><searchLink fieldCode="AU" term="%22Lee%2C+C%2E-B%2E%22">Lee, C.-B.</searchLink><br /><searchLink fieldCode="AU" term="%22Jung%2C+S%2E-B%2E%22">Jung, S.-B.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Materials+Science+%26+Technology%22">Materials Science & Technology</searchLink>; August 2003, Vol. 19 Issue 8, p1101-1106, 6p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500874030
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      – Type: doi
        Value: 10.1179/026708303225003063
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 1101
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      – TitleFull: Activation energies of intermetallic compound growth at interface between Sn-5Bi-3.5Ag solder and Cu substrate.
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            NameFull: Yoon, J.-W.
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            NameFull: Lee, C.-B.
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            NameFull: Jung, S.-B.
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            – D: 01
              M: 08
              Text: August 2003
              Type: published
              Y: 2003
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