The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.
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| Title: | The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging. |
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| Authors: | Wong, E. H., Rajoo, R., Koh, S. W. |
| Source: | Journal of Electronic Packaging; June 2002, Vol. 124 Issue 2, p122-126, 5p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10437398 |
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| DOI: | 10.1115/1.1461367 |
