APA (7th ed.) Citation

Wong, E. H., Rajoo, R., & Koh, S. W. (2002). The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging. Journal of Electronic Packaging, 124(2), 122. https://doi.org/10.1115/1.1461367

Chicago Style (17th ed.) Citation

Wong, E. H., R. Rajoo, and S. W. Koh. "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging." Journal of Electronic Packaging 124, no. 2 (2002): 122. https://doi.org/10.1115/1.1461367.

MLA (9th ed.) Citation

Wong, E. H., et al. "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging." Journal of Electronic Packaging, vol. 124, no. 2, 2002, p. 122, https://doi.org/10.1115/1.1461367.