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The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.

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Title: The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.
Authors: Wong, E. H., Rajoo, R., Koh, S. W.
Source: Journal of Electronic Packaging; June 2002, Vol. 124 Issue 2, p122-126, 5p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500883444
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.
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  Data: <searchLink fieldCode="AU" term="%22Wong%2C+E%2E+H%2E%22">Wong, E. H.</searchLink><br /><searchLink fieldCode="AU" term="%22Rajoo%2C+R%2E%22">Rajoo, R.</searchLink><br /><searchLink fieldCode="AU" term="%22Koh%2C+S%2E+W%2E%22">Koh, S. W.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>; June 2002, Vol. 124 Issue 2, p122-126, 5p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500883444
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1115/1.1461367
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 5
        StartPage: 122
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      – TitleFull: The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.
        Type: main
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          Name:
            NameFull: Wong, E. H.
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            NameFull: Rajoo, R.
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            NameFull: Koh, S. W.
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            – D: 01
              M: 06
              Text: June 2002
              Type: published
              Y: 2002
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              Value: 124
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