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The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.

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Bibliographic Details
Title: The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging.
Authors: Wong, E. H., Rajoo, R., Koh, S. W.
Source: Journal of Electronic Packaging; June 2002, Vol. 124 Issue 2, p122-126, 5p
Database: Applied Science & Technology Source
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