Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph.

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Bibliographic Details
Title: Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph.
Authors: Tay, C. J., Wang, S. H., Quan, C.
Source: Optical Engineering; Apr2004, Vol. 43 Issue 4, p963-970, 8p
Database: Applied Science & Technology Source
Description
ISSN:00913286
DOI:10.1117/1.1668284