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Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph.

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Bibliographic Details
Title: Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph.
Authors: Tay, C. J., Wang, S. H., Quan, C.
Source: Optical Engineering; Apr2004, Vol. 43 Issue 4, p963-970, 8p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 500970720
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph.
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  Data: <searchLink fieldCode="AU" term="%22Tay%2C+C%2E+J%2E%22">Tay, C. J.</searchLink><br /><searchLink fieldCode="AU" term="%22Wang%2C+S%2E+H%2E%22">Wang, S. H.</searchLink><br /><searchLink fieldCode="AU" term="%22Quan%2C+C%2E%22">Quan, C.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Optical+Engineering%22">Optical Engineering</searchLink>; Apr2004, Vol. 43 Issue 4, p963-970, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=500970720
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1117/1.1668284
    Languages:
      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 963
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      – TitleFull: Inspection of micro-solderballs on a semiconductor bumped wafer using optical shadowgraph.
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            NameFull: Tay, C. J.
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            NameFull: Wang, S. H.
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              M: 04
              Text: Apr2004
              Type: published
              Y: 2004
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              Value: 43
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            – TitleFull: Optical Engineering
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