Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.

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Bibliographic Details
Title: Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.
Authors: Turqueti, M., Cihangir, S., Kwan, S.
Source: IEEE Transactions on Nuclear Science; Oct2004 Part 1 of 4, Vol. 51 Issue 5, p2161-2167, 7p
Database: Applied Science & Technology Source
Description
ISSN:00189499
DOI:10.1109/TNS.2004.834709