APA (7th ed.) Citation

Turqueti, M., Cihangir, S., & Kwan, S. (2004). Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector. IEEE Transactions on Nuclear Science, 51(5), 2161. https://doi.org/10.1109/TNS.2004.834709

Chicago Style (17th ed.) Citation

Turqueti, M., S. Cihangir, and S. Kwan. "Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector." IEEE Transactions on Nuclear Science 51, no. 5 (2004): 2161. https://doi.org/10.1109/TNS.2004.834709.

MLA (9th ed.) Citation

Turqueti, M., et al. "Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector." IEEE Transactions on Nuclear Science, vol. 51, no. 5, 2004, p. 2161, https://doi.org/10.1109/TNS.2004.834709.