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Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.

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Title: Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.
Authors: Turqueti, M., Cihangir, S., Kwan, S.
Source: IEEE Transactions on Nuclear Science; Oct2004 Part 1 of 4, Vol. 51 Issue 5, p2161-2167, 7p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501045982
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Nuclear+Science%22">IEEE Transactions on Nuclear Science</searchLink>; Oct2004 Part 1 of 4, Vol. 51 Issue 5, p2161-2167, 7p
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      – Type: doi
        Value: 10.1109/TNS.2004.834709
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      – Code: eng
        Text: English
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        PageCount: 7
        StartPage: 2161
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      – TitleFull: Study of Temperature Dependence of Bump Bonding for the BTeV Pixel Detector.
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            NameFull: Turqueti, M.
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            NameFull: Cihangir, S.
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            NameFull: Kwan, S.
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            – D: 01
              M: 10
              Text: Oct2004 Part 1 of 4
              Type: published
              Y: 2004
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              Value: 51
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