A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.
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| Title: | A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing. |
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| Authors: | Becker, K.-F., Braun, T., Neumann, A. |
| Source: | Journal of Electronic Packaging; March 2005, Vol. 127 Issue 1, p1-6, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10437398 |
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| DOI: | 10.1115/1.1846058 |
