APA (7th ed.) Citation

Becker, K., Braun, T., & Neumann, A. (2005). A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing. Journal of Electronic Packaging, 127(1), 1. https://doi.org/10.1115/1.1846058

Chicago Style (17th ed.) Citation

Becker, K.-F, T. Braun, and A. Neumann. "A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing." Journal of Electronic Packaging 127, no. 1 (2005): 1. https://doi.org/10.1115/1.1846058.

MLA (9th ed.) Citation

Becker, K.-F, et al. "A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing." Journal of Electronic Packaging, vol. 127, no. 1, 2005, p. 1, https://doi.org/10.1115/1.1846058.