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A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.

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Bibliographic Details
Title: A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing.
Authors: Becker, K.-F., Braun, T., Neumann, A.
Source: Journal of Electronic Packaging; March 2005, Vol. 127 Issue 1, p1-6, 6p
Database: Applied Science & Technology Source
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