Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.
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| Title: | Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders. |
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| Authors: | Huang, M. L., Loeher, T., Manessis, D. |
| Source: | Journal of Electronic Materials; January 2006, Vol. 35 Issue 1, p181-188, 8p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-006-0202-1 |
