APA (7th ed.) Citation

Huang, M. L., Loeher, T., & Manessis, D. (2006). Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders. Journal of Electronic Materials, 35(1), 181. https://doi.org/10.1007/s11664-006-0202-1

Chicago Style (17th ed.) Citation

Huang, M. L., T. Loeher, and D. Manessis. "Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders." Journal of Electronic Materials 35, no. 1 (2006): 181. https://doi.org/10.1007/s11664-006-0202-1.

MLA (9th ed.) Citation

Huang, M. L., et al. "Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders." Journal of Electronic Materials, vol. 35, no. 1, 2006, p. 181, https://doi.org/10.1007/s11664-006-0202-1.