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Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.

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Title: Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.
Authors: Huang, M. L., Loeher, T., Manessis, D.
Source: Journal of Electronic Materials; January 2006, Vol. 35 Issue 1, p181-188, 8p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501195208
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.
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  Data: <searchLink fieldCode="AU" term="%22Huang%2C+M%2E+L%2E%22">Huang, M. L.</searchLink><br /><searchLink fieldCode="AU" term="%22Loeher%2C+T%2E%22">Loeher, T.</searchLink><br /><searchLink fieldCode="AU" term="%22Manessis%2C+D%2E%22">Manessis, D.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; January 2006, Vol. 35 Issue 1, p181-188, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501195208
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-006-0202-1
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 8
        StartPage: 181
    Titles:
      – TitleFull: Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.
        Type: main
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            NameFull: Huang, M. L.
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            NameFull: Loeher, T.
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            NameFull: Manessis, D.
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            – D: 01
              M: 01
              Text: January 2006
              Type: published
              Y: 2006
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              Value: 35
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            – TitleFull: Journal of Electronic Materials
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