Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.

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Bibliographic Details
Title:	Morphology and Growth Kinetics of Intermetallic Compounds in Solid-State Interfacial Reaction of Electroless Ni-P with Sn-Based Lead-Free Solders.
Authors:	Huang, M. L., Loeher, T., Manessis, D.
Source:	Journal of Electronic Materials; January 2006, Vol. 35 Issue 1, p181-188, 8p
Database:	Applied Science & Technology Source

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