Modeling self-annealing kinetics in electroplated Cu thin films.

Saved in:
Bibliographic Details
Title: Modeling self-annealing kinetics in electroplated Cu thin films.
Authors: Stangl, M., Militzer, M.
Source: Journal of Applied Physics; June 1 2008, Vol. 103 Issue 11, p113521-113521, 1p
Database: Applied Science & Technology Source
Description
ISSN:00218979
DOI:10.1063/1.2937249