A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.
Saved in:
| Title: | A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector. |
|---|---|
| Authors: | Campbell, M., Rinella, G. Aglieri, Izquierdo, G. Arnau |
| Source: | IEEE Transactions on Nuclear Science; August 2006 pt2, Vol. 53 Issue 4, p2296-2302, 7p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00189499 |
|---|---|
| DOI: | 10.1109/TNS.2006.880537 |
