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A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.

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Title: A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.
Authors: Campbell, M., Rinella, G. Aglieri, Izquierdo, G. Arnau
Source: IEEE Transactions on Nuclear Science; August 2006 pt2, Vol. 53 Issue 4, p2296-2302, 7p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501301180
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.
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  Data: <searchLink fieldCode="AU" term="%22Campbell%2C+M%2E%22">Campbell, M.</searchLink><br /><searchLink fieldCode="AU" term="%22Rinella%2C+G%2E+Aglieri%22">Rinella, G. Aglieri</searchLink><br /><searchLink fieldCode="AU" term="%22Izquierdo%2C+G%2E+Arnau%22">Izquierdo, G. Arnau</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Nuclear+Science%22">IEEE Transactions on Nuclear Science</searchLink>; August 2006 pt2, Vol. 53 Issue 4, p2296-2302, 7p
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    Identifiers:
      – Type: doi
        Value: 10.1109/TNS.2006.880537
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      – Code: eng
        Text: English
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        PageCount: 7
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      – TitleFull: A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.
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            NameFull: Campbell, M.
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            NameFull: Rinella, G. Aglieri
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            NameFull: Izquierdo, G. Arnau
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              Text: August 2006 pt2
              Type: published
              Y: 2006
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