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A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.

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Bibliographic Details
Title: A Fine Pitch Bump Bonding Process Compatible With the Manufacture of the Pixel-HPD's for the LHCb RICH Detector.
Authors: Campbell, M., Rinella, G. Aglieri, Izquierdo, G. Arnau
Source: IEEE Transactions on Nuclear Science; August 2006 pt2, Vol. 53 Issue 4, p2296-2302, 7p
Database: Applied Science & Technology Source
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