Investigations of silicon wafer grinding using finite element analysis.
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| Title: | Investigations of silicon wafer grinding using finite element analysis. |
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| Authors: | Liu, J. H., Pei, Z. J., Fisher, G. R. |
| Source: | International Journal of Computer Applications in Technology; 2007, Vol. 29 Issue 2/4, p102-107, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 09528091 |
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| DOI: | 10.1504/IJCAT.2007.015243 |
