APA (7th ed.) Citation

Liu, J. H., Pei, Z. J., & Fisher, G. R. (2007). Investigations of silicon wafer grinding using finite element analysis. International Journal of Computer Applications in Technology, 29(2/4), 102. https://doi.org/10.1504/IJCAT.2007.015243

Chicago Style (17th ed.) Citation

Liu, J. H., Z. J. Pei, and G. R. Fisher. "Investigations of Silicon Wafer Grinding Using Finite Element Analysis." International Journal of Computer Applications in Technology 29, no. 2/4 (2007): 102. https://doi.org/10.1504/IJCAT.2007.015243.

MLA (9th ed.) Citation

Liu, J. H., et al. "Investigations of Silicon Wafer Grinding Using Finite Element Analysis." International Journal of Computer Applications in Technology, vol. 29, no. 2/4, 2007, p. 102, https://doi.org/10.1504/IJCAT.2007.015243.