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Investigations of silicon wafer grinding using finite element analysis.

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Bibliographic Details
Title: Investigations of silicon wafer grinding using finite element analysis.
Authors: Liu, J. H., Pei, Z. J., Fisher, G. R.
Source: International Journal of Computer Applications in Technology; 2007, Vol. 29 Issue 2/4, p102-107, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501372722
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Investigations of silicon wafer grinding using finite element analysis.
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  Data: <searchLink fieldCode="AU" term="%22Liu%2C+J%2E+H%2E%22">Liu, J. H.</searchLink><br /><searchLink fieldCode="AU" term="%22Pei%2C+Z%2E+J%2E%22">Pei, Z. J.</searchLink><br /><searchLink fieldCode="AU" term="%22Fisher%2C+G%2E+R%2E%22">Fisher, G. R.</searchLink>
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501372722
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1504/IJCAT.2007.015243
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 102
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      – TitleFull: Investigations of silicon wafer grinding using finite element analysis.
        Type: main
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            NameFull: Liu, J. H.
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            NameFull: Pei, Z. J.
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            NameFull: Fisher, G. R.
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              Text: 2007
              Type: published
              Y: 2007
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              Value: 29
            – Type: issue
              Value: 2/4
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            – TitleFull: International Journal of Computer Applications in Technology
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