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Investigations of silicon wafer grinding using finite element analysis.

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Bibliographic Details
Title: Investigations of silicon wafer grinding using finite element analysis.
Authors: Liu, J. H., Pei, Z. J., Fisher, G. R.
Source: International Journal of Computer Applications in Technology; 2007, Vol. 29 Issue 2/4, p102-107, 6p
Database: Applied Science & Technology Source
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