Chip-to-Board Micromachining for Interconnect Layer Passive Components.
Saved in:
| Title: | Chip-to-Board Micromachining for Interconnect Layer Passive Components. |
|---|---|
| Authors: | Joung, Yeun-Ho, Allen, Mark G. |
| Source: | IEEE Transactions on Components & Packaging Technologies; March 2007, Vol. 30 Issue 1, p15-23, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 15213331 |
|---|---|
| DOI: | 10.1109/TCAPT.2007.892062 |
