APA (7th ed.) Citation

Joung, Y., & Allen, M. G. (2007). Chip-to-Board Micromachining for Interconnect Layer Passive Components. IEEE Transactions on Components & Packaging Technologies, 30(1), 15. https://doi.org/10.1109/TCAPT.2007.892062

Chicago Style (17th ed.) Citation

Joung, Yeun-Ho, and Mark G. Allen. "Chip-to-Board Micromachining for Interconnect Layer Passive Components." IEEE Transactions on Components & Packaging Technologies 30, no. 1 (2007): 15. https://doi.org/10.1109/TCAPT.2007.892062.

MLA (9th ed.) Citation

Joung, Yeun-Ho, and Mark G. Allen. "Chip-to-Board Micromachining for Interconnect Layer Passive Components." IEEE Transactions on Components & Packaging Technologies, vol. 30, no. 1, 2007, p. 15, https://doi.org/10.1109/TCAPT.2007.892062.