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Chip-to-Board Micromachining for Interconnect Layer Passive Components.

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Bibliographic Details
Title: Chip-to-Board Micromachining for Interconnect Layer Passive Components.
Authors: Joung, Yeun-Ho, Allen, Mark G.
Source: IEEE Transactions on Components & Packaging Technologies; March 2007, Vol. 30 Issue 1, p15-23, 9p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
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PubType: Academic Journal
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        Value: 10.1109/TCAPT.2007.892062
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      – Code: eng
        Text: English
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        PageCount: 9
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      – TitleFull: Chip-to-Board Micromachining for Interconnect Layer Passive Components.
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              Text: March 2007
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