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Chip-to-Board Micromachining for Interconnect Layer Passive Components.

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Bibliographic Details
Title: Chip-to-Board Micromachining for Interconnect Layer Passive Components.
Authors: Joung, Yeun-Ho, Allen, Mark G.
Source: IEEE Transactions on Components & Packaging Technologies; March 2007, Vol. 30 Issue 1, p15-23, 9p
Database: Applied Science & Technology Source
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