Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading.
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| Title: | Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading. |
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| Authors: | Wunderle, B., Braun, T., May, D. |
| Source: | Journal of Electronic Packaging; March 2009, Vol. 131 Issue 1, p90-95, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10437398 |
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| DOI: | 10.1115/1.3078187 |
