APA (7th ed.) Citation

Wunderle, B., Braun, T., & May, D. (2009). Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading. Journal of Electronic Packaging, 131(1), 90. https://doi.org/10.1115/1.3078187

Chicago Style (17th ed.) Citation

Wunderle, B., T. Braun, and D. May. "Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading." Journal of Electronic Packaging 131, no. 1 (2009): 90. https://doi.org/10.1115/1.3078187.

MLA (9th ed.) Citation

Wunderle, B., et al. "Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading." Journal of Electronic Packaging, vol. 131, no. 1, 2009, p. 90, https://doi.org/10.1115/1.3078187.