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Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading.

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Bibliographic Details
Title: Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading.
Authors: Wunderle, B., Braun, T., May, D.
Source: Journal of Electronic Packaging; March 2009, Vol. 131 Issue 1, p90-95, 6p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501402052
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading.
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>; March 2009, Vol. 131 Issue 1, p90-95, 6p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501402052
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1115/1.3078187
    Languages:
      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 90
    Titles:
      – TitleFull: Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading.
        Type: main
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            NameFull: Wunderle, B.
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            NameFull: Braun, T.
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            NameFull: May, D.
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            – D: 01
              M: 03
              Text: March 2009
              Type: published
              Y: 2009
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              Value: 131
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            – TitleFull: Journal of Electronic Packaging
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