Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.

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Bibliographic Details
Title:	Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.
Authors:	Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Source:	Materials Science & Technology; April 2007, Vol. 23 Issue 4, p411-416, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	02670836
DOI:	10.1179/174328407X177009