APA (7th ed.) Citation

Yoon, J., Kim, S., & Jung, S. (2007). Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint. Materials Science & Technology, 23(4), 411. https://doi.org/10.1179/174328407X177009

Chicago Style (17th ed.) Citation

Yoon, J.-W, S.-W Kim, and S.-B Jung. "Effect of High Temperature Storage Test on Reliability of Eutectic Sn-Cu/ENIG Solder Joint." Materials Science & Technology 23, no. 4 (2007): 411. https://doi.org/10.1179/174328407X177009.

MLA (9th ed.) Citation

Yoon, J.-W, et al. "Effect of High Temperature Storage Test on Reliability of Eutectic Sn-Cu/ENIG Solder Joint." Materials Science & Technology, vol. 23, no. 4, 2007, p. 411, https://doi.org/10.1179/174328407X177009.