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Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.

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Bibliographic Details
Title: Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.
Authors: Yoon, J.-W., Kim, S.-W., Jung, S.-B.
Source: Materials Science & Technology; April 2007, Vol. 23 Issue 4, p411-416, 6p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501404299
AccessLevel: 2
PubType: Academic Journal
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  Data: Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.
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        Value: 10.1179/174328407X177009
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 411
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      – TitleFull: Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.
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            NameFull: Yoon, J.-W.
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            NameFull: Kim, S.-W.
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            NameFull: Jung, S.-B.
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              Text: April 2007
              Type: published
              Y: 2007
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