Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint.
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| Title: | Effect of high temperature storage test on reliability of eutectic Sn-Cu/ENIG solder joint. |
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| Authors: | Yoon, J.-W., Kim, S.-W., Jung, S.-B. |
| Source: | Materials Science & Technology; April 2007, Vol. 23 Issue 4, p411-416, 6p |
| Database: | Applied Science & Technology Source |
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