Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics.
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| Title: | Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics. |
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| Authors: | Webb, D. Patrick, Hutt, David A., Hopkinson, Neil |
| Source: | Journal of Microelectromechanical Systems; April 2009, Vol. 18 Issue 2, p354-362, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10577157 |
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| DOI: | 10.1109/JMEMS.2009.2013404 |
