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Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics.

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Bibliographic Details
Title: Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics.
Authors: Webb, D. Patrick, Hutt, David A., Hopkinson, Neil
Source: Journal of Microelectromechanical Systems; April 2009, Vol. 18 Issue 2, p354-362, 9p
Database: Applied Science & Technology Source
FullText Text:
  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 501414985
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics.
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  Data: <searchLink fieldCode="AU" term="%22Webb%2C+D%2E+Patrick%22">Webb, D. Patrick</searchLink><br /><searchLink fieldCode="AU" term="%22Hutt%2C+David+A%2E%22">Hutt, David A.</searchLink><br /><searchLink fieldCode="AU" term="%22Hopkinson%2C+Neil%22">Hopkinson, Neil</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectromechanical+Systems%22">Journal of Microelectromechanical Systems</searchLink>; April 2009, Vol. 18 Issue 2, p354-362, 9p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=501414985
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/JMEMS.2009.2013404
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 9
        StartPage: 354
    Titles:
      – TitleFull: Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics.
        Type: main
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          Name:
            NameFull: Webb, D. Patrick
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            NameFull: Hutt, David A.
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            NameFull: Hopkinson, Neil
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            – D: 01
              M: 04
              Text: April 2009
              Type: published
              Y: 2009
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              Value: 18
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              Value: 2
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            – TitleFull: Journal of Microelectromechanical Systems
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