Cracking and Phase Stability in Reaction Layers between Sn-Cu-Ni Solders and Cu Substrate.

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Bibliographic Details
Title:	Cracking and Phase Stability in Reaction Layers between Sn-Cu-Ni Solders and Cu Substrate.
Authors:	Nogita, K., Gourlay, C. M., Nishimura, T.
Source:	JOM: The Journal of The Minerals, Metals & Materials Society (TMS); June 2009, Vol. 61 Issue 6, p45-51, 5p
Database:	Applied Science & Technology Source

Description
ISSN:	10474838
DOI:	10.1007/s11837-009-0087-6