APA (7th ed.) Citation

Nogita, K., Gourlay, C. M., & Nishimura, T. (2009). Cracking and Phase Stability in Reaction Layers between Sn-Cu-Ni Solders and Cu Substrate. JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 61(6), 45. https://doi.org/10.1007/s11837-009-0087-6

Chicago Style (17th ed.) Citation

Nogita, K., C. M. Gourlay, and T. Nishimura. "Cracking and Phase Stability in Reaction Layers Between Sn-Cu-Ni Solders and Cu Substrate." JOM: The Journal of The Minerals, Metals & Materials Society (TMS) 61, no. 6 (2009): 45. https://doi.org/10.1007/s11837-009-0087-6.

MLA (9th ed.) Citation

Nogita, K., et al. "Cracking and Phase Stability in Reaction Layers Between Sn-Cu-Ni Solders and Cu Substrate." JOM: The Journal of The Minerals, Metals & Materials Society (TMS), vol. 61, no. 6, 2009, p. 45, https://doi.org/10.1007/s11837-009-0087-6.