Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads.

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Bibliographic Details
Title:	Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads.
Authors:	Lin, W. H., Wu, Albert T., Lin, S. Z.
Source:	Journal of Electronic Materials; July 2007, Vol. 36 Issue 7, p753-759, 7p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-007-0139-z