Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.

Saved in:

Bibliographic Details
Title:	Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration.
Authors:	Lin, Y. L., Lai, Y. S., Lin, Y. W.
Source:	Journal of Electronic Materials; January 2008, Vol. 37 Issue 1, p96-101, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	03615235
DOI:	10.1007/s11664-007-0293-3