APA (7th ed.) Citation

Lin, Y. L., Lai, Y. S., & Lin, Y. W. (2008). Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration. Journal of Electronic Materials, 37(1), 96. https://doi.org/10.1007/s11664-007-0293-3

Chicago Style (17th ed.) Citation

Lin, Y. L., Y. S. Lai, and Y. W. Lin. "Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints Under Electromigration." Journal of Electronic Materials 37, no. 1 (2008): 96. https://doi.org/10.1007/s11664-007-0293-3.

MLA (9th ed.) Citation

Lin, Y. L., et al. "Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints Under Electromigration." Journal of Electronic Materials, vol. 37, no. 1, 2008, p. 96, https://doi.org/10.1007/s11664-007-0293-3.