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Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.

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Bibliographic Details
Title: Critical Current Density for Inhibiting (Cu,Ni)6Sn5 Formation on the Ni Side of Cu/Solder/Ni Joints.
Authors: Wu, W. H., Chung, H. L., Chen, B. Z.
Source: Journal of Electronic Materials; December 2010, Vol. 39 Issue 12, p2653-2661, 9p
Database: Applied Science & Technology Source
Description
ISSN:03615235
DOI:10.1007/s11664-010-1299-9